Why choose us
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Application Advantage
Realize high precision, automatic positioning, focusing, high processing efficiency
No collapse, no dust, small cutting heat affected area, high machining accuracy
High beam quality, high motion accuracy, fast marking speed and stable performance
Unattended automatic operation, mass production, complete functions
effect display
Sample: 12-inch wafer Process: Wafer laser dicing
Sample: Wafer Process: Laser Dicing
Sample: Wafer Process: Wafer Cutting
Sample: 8-inch wafer Process: ID number laser marking
Sample: 6-inch wafer Process: Wafer laser cutting
Sample: 12-inch wafer Process: Wafer laser back grinding
Product display
This device is mainly designed for high-speed laser processing of thin plates. The overall operation of the machine is stable, the technology is mature, and the cutting efficiency is high. The main body of the equipment has good overall rigidity and high strength, with the base made of Jinan green marble and the beam made of extruded aluminum profiles, which can effectively prevent structural deformation.
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This device is mainly designed for high-speed laser processing of thin plates. The overall operation of the machine is stable, the technology is mature, and the cutting efficiency is high. The main body of the equipment has good overall rigidity and high strength, with the base made of Jinan green marble and the beam made of extruded aluminum profiles, which can effectively prevent structural deformation.
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