Fully Automatic Visual AOI Inspection Machine

The fully automatic wafer appearance inspection machine is mainly suitable for detecting wafer appearance defects to improve customer production efficiency; it is suitable for 4 inch, 6 inch, and 8 inch wafers.

Quotation

Product Description

Product Features:

• Supports simultaneous line width measurement and etching measurement in one.
• Surface defect detection capability can reach 0.3um.
• Automatic detection without manual intervention, single machine defect detection mode.
• Flexible and efficient multi-method defect and automatic defect classification.
• Detection of single-layer and multi-layer patterns, and custom area detection.
• High precision line width measurement and etching size measurement system.
• Automatic script programming capability and automated operation.
• Comes with automatic detection cassette function, built-in mapping function, capable of double-sided detection.
• Wafer robotic arm completes wafer operation within the equipment; JEL/self-developed robotic arm.

Applications:

Fully automatic wafer appearance inspection machine is mainly suitable for detecting wafer appearance defects to improve customer production efficiency; suitable for 4inch, 6inch, 8inch wafers.

Product Parameters

Laser Type Configuration	Device Model SL-WOV1020
Applicable Wafers	4 inch, 6 inch, 8 inch
Line scan camera + laser measuring instrument	16K line scan camera + laser measuring instrument: width 6mm scanning interval lum-10um;
Camera Lens	Lens WD:49mm FOV:360mm Image Resolution: 2lum
Line Scan Coaxial Light Source	Illuminating Area 340mm*40mm
Line Scan Line Light Source	Combined light source; line light source 2 sets; illuminating area 340mm*20mm
Detection Type	Appearance defects; Size, Thickness Measurement
Product Loading and Unloading Method	Open cassette;
Product Transfer Method	Japan JEL Wafer ROBOT + Mapping Function
Wafer Stage	X.Y.Z.R Stage: Forming 6.5mm; coarse adjustment 360°, fine adjustment ±5°, minimum stroke 5um
Wafer Translation Module	Stroke 350mm' repeat accuracy ±20um
Software	Self-developed wafer appearance inspection software system;
OCR Reading	Visual Recognition (optional)
FFU	Dual FFU; 99.995%@0.3um; 400-500cmh
System Integration	MES and EAP (with TCP/IP; supports SECS-GEM communication standard)
Device Dimensions	L:1700mmW:1350mmH:1900mm

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After-sales service telephone:

East China:+86 18015372888
South China:+86 13922984659

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