HTCC/LTCC laser drilling/cutting machine

Mainly used for rapid processing of through holes, semi-through holes, and cavities in materials such as LTCC green bodies and ferrites, as well as for fine processing such as etching and cutting of various materials.

Product Description

Device Introduction:

Mainly used for rapid processing of through holes, semi-through holes, and cavities in materials such as LTCC green bodies and ferrites, as well as fine processing such as etching and cutting of various materials.

 

Device Advantages:

1. Dual-head laser processing equipment, achieving high-speed drilling with two sets of galvanometer systems simultaneously, with a single-head drilling speed exceeding 2000 holes/H, and a continuously adjustable hole diameter of 20-40um.

2. Achieves fully automatic loading and unloading, saving labor and improving equipment working efficiency.

3. For different sizes of customer substrates, the relative position between suction cups is adjustable, thus accommodating substrates of different sizes, including 6-inch and 8-inch.

4. Stable operation, high processing accuracy, with a processing precision of less than ±5um.

 

Device Field:

Applied in the display industry for rapid processing of through holes, semi-through holes, and cavities in LTCC green bodies and ferrites for electrical components.

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