Silicon carbide wafer ID laser marking equipment

The fully automatic wafer laser marking machine is mainly used for precise marking of various epitaxial silicon wafers, advanced packaging composite wafers, and SIC wafers; suitable for 6 inch, 8 inch, and 12 inch wafer coding.

Quotation

Product Description

Product Features:

• Professional material box loading and unloading, robotic arm for material picking, marking, and returning to original position

• Fully automatic operation, visual automatic edge detection and positioning mechanism, high processing efficiency

• Automatic detection of whether there are products in the material box, robotic arm with Mapping function, can choose double-sided marking

• Wafer robotic arm completes the operation of wafers within the equipment, JEL dedicated wafer robotic arm

• Standard configuration of FFU with 99.995% 0.3um filtration, effectively ensuring cleanliness inside the machine

Application Areas:

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After-sales service telephone:

East China:+86 18015372888
South China:+86 13922984659

Business License