Fully Automatic IC Plastic Sealing Laser Cutting Machine

Used for laser rules or precision cutting of plastic encapsulated bodies such as SIP, LGA, and IC substrates.

Product Description

Product Features:

• Quickly scan and smartly import work orders and switch processes; Vision inspection for incoming materials front and back.

• The equipment has multiple foolproof functions for material drop and jam alarms; magazine traceability to prevent material mixing.

• Optional power calibration module to ensure cutting quality and stable, reliable effects.

• Optional Vision inspection function; ensures stable cutting dimensions and effects.

• The equipment is equipped with multiple safety protection functions, safety door control, safety warning labels, electrical protection, ensuring safe operation for personnel.

 

Application Areas:

Used for laser precision cutting of encapsulated bodies such as integrated circuit SIP, LGA, and IC substrates.

 

 

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