IC chip laser cover opening machine

Laser removal of the upper cover for encapsulated chips (IC packaging mounted on copper frames, PCB substrates, and ceramic substrates)

Quotation

Product Description

Product Features:

1. The surface of the package can be opened, and the shape and size of the opening can be flexibly set.

2. The entire process of the opening technology is intuitively and comprehensively displayed, with computer control of the opening shape.

3. High repeatability, ensuring consistency in the opening of all devices.

4. CCD video observation of the laser opening effect, providing real-time monitoring of the opening situation.

5. The opening depth is set by software, and the opening shape and depth can be adjusted based on CCD effects, saving opening time.

Applications:

Suitable for laser removal of the upper cover of packaged chips (IC encapsulated bodies mounted on copper frames, PCB substrates, and ceramic substrates).

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After-sales service telephone:

East China:+86 18015372888
South China:+86 13922984659

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