Wafer ID laser marking equipment

The fully automatic wafer laser marking machine is mainly used for precision ID marking on various silicon wafers, sapphire glass wafers, and SiC wafers; suitable for 4 inch, 6 inch, and 8 inch wafers.

Quotation

Product Description

Product Features:

• Material box loading and unloading method, material retrieval, marking, and returning material to original position.

• Fully automatic loading and unloading, visual or automatic edge-finding mechanism positioning, high processing efficiency.

• The device is compact and easy to use.

• Comes with automatic detection material box function, autonomous counting Mapping function, capable of double-sided marking.

• Wafer manipulator completes wafer operation within the device; JEL/First Laser autonomous manipulator.

Product Application Areas:

Fully automatic wafer laser marking machine is mainly used for precise ID marking of various silicon wafers, sapphire glass wafers, and SiC wafers; suitable for 4 inch, 6 inch, 8 inch wafers.

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After-sales service telephone:

East China:+86 18015372888
South China:+86 13922984659

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