Wafer Laser Invisible Cutting Machine

The fully automatic wafer laser invisible cutting equipment is mainly suitable for various semiconductor wafer materials such as silicon, germanium, silicon carbide, and zinc oxide. Invisible cutting focuses the laser inside the workpiece, forming a modified layer within the workpiece, and uses methods such as expanding adhesive films to divide the workpiece into chips; it is suitable for 4 inch, 6 inch, and 8 inch wafers.

Quotation

Product Description

Product Features:

• FFC loading and unloading method, material picking, cutting, and returning to the original position.

• Multi-camera visual grabbing of wafer edges and feature point positioning, automatic alignment, automatic focusing; high-precision motion platform.

• Fully automatic loading and unloading, stable and reliable optical path, high-precision vision system, high processing efficiency.

• First Ray independently developed software system, easy to operate, fully functional.

• Optional focus: single focus, dual focus, multi-focus (optional).

Applications

Fully automatic wafer laser invisible cutting equipment is mainly suitable for various semiconductor materials such as silicon, germanium, silicon carbide, zinc oxide, etc. Invisible cutting focuses the laser inside the workpiece, forming a modified layer within the workpiece, and the cutting method divides the workpiece into chips through methods such as expanding adhesive films; suitable for 4 inch, 6 inch, 8 inch wafers.

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After-sales service telephone:

East China:+86 18015372888
South China:+86 13922984659

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