Fully Automatic Wafer Laser Grooving Cutting Machine

Scribing and cutting of integrated circuit wafers, GPP diode wafers, and thyristor wafers, as well as surface grooving of low-k wafers with a line width of 40nm and below. Suitable for 8-inch and 12-inch wafers.

Quotation

Product Description

Product Features:

1. Using ultra-short pulse width processing, effectively improving the quality of cutting lines with a heat-affected zone of <2um after grooving.

2. Using a combination of mask plates and gratings to achieve the required spot pattern for grooving; integrating various laser micro-processing technologies and process solutions to achieve the effect of grooving and cutting.

3. Using high-resolution, Brand CCD lenses to achieve high precision, automatic positioning, focusing, and other functions, allowing for the collection of any feature points.

4. Automatic loading and unloading functions, unattended fully automatic operation, and batch production.

Product Application Areas:

Applications: Scribing and cutting of integrated circuit wafers, GPP diode wafers, and thyristor wafers, as well as surface grooving of low-k wafers with a line width of 40nm and below. Suitable for 8-inch and 12-inch wafers.

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After-sales service telephone:

East China:+86 18015372888
South China:+86 13922984659

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