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Fully Automatic Visual AOI Inspection Machine
Product Description
Product Features:
• Detection supports simultaneous measurement of line width and etching measurement in one.
• Surface defect detection capability can reach 0.3um.
• Automatic detection without manual intervention, single machine defect detection mode.
• Flexible and efficient multi-method defect and automatic defect classification.
• Single-layer and multi-layer graphic detection, as well as custom area detection.
• High-precision line width measurement and etching size measurement system.
• Automatic script programming capability and automated operation.
• Comes with an automatic detection material box function, has mapping capability, and can perform double-sided detection.
• Wafer robotic arm completes wafer operation within the equipment; JEL/self-laser autonomous robotic arm.
Product Applications:
Fully automatic wafer appearance inspection machine is mainly suitable for detecting wafer appearance defects to improve customer production efficiency; suitable for 4inch, 6inch, 8inch wafers.
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