Laser cutting machine

Applicable to the PCB and SMT industries. For cutting and drilling of FPC soft boards, cutting of PCB circuit boards, cutting of camera modules, cutting of fingerprint recognition chips, cutting of semiconductors, etc.

Quotation

Product Description

Device Introduction:

This device is a specialized cutting equipment designed using laser technology and CNC technology, featuring stable laser power, good beam mode, high peak power, low cost, safety, stability, and simple operation. (This machine is a standard model and can be optionally equipped with fully automatic or sheet-to-sheet, roll-to-sheet configurations.)

Device Advantages:

High processing efficiency and good working stability

CDD visual pre-scanning and automatic target positioning, with a maximum processing range of 650mm x 550mm and XY platform splicing accuracy of ≤5μm.

Good cutting seam quality, minimal deformation, smooth and beautiful appearance

Mature processing technology, suitable for various graphic processing

The focusing spot can reach a minimum of 7μm, making it suitable for fine cutting and drilling of both organic and inorganic materials.

Integrates CNC technology, laser technology, software technology, and other optoelectronic technologies, characterized by high precision and high flexibility

Device Fields:

Applied in the PCB and SMT industries. For cutting and drilling of FPC flexible boards, PCB circuit board separation cutting, camera module cutting, fingerprint recognition chip cutting, semiconductor cutting, etc.

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After-sales service telephone:

East China:+86 18015372888
South China:+86 13922984659

Business License