Laser splitting machine

This device is a specialized cutting equipment designed using laser technology and CNC technology, featuring stable laser power, good beam mode, high peak power, low cost, safety, stability, and simple operation. (This machine is a standard model and can be optionally equipped with fully automatic or sheet-to-sheet, roll-to-sheet configurations.)

Product Description

Device Introduction:

This device is a specialized cutting equipment designed using laser technology and CNC technology, featuring stable laser power, good beam mode, high peak power, low cost, safety, stability, and simple operation. (This machine is a standard model and can be optionally equipped with fully automatic or sheet-to-sheet, roll-to-sheet configurations.)

 

Product Advantages:

1. High processing efficiency and good working stability.

2. CDD visual pre-scanning and automatic target positioning, with a maximum processing range of 650mm x 550mm and XY platform splicing accuracy of ≤5μm.

3. Good cutting seam quality, minimal deformation, smooth and aesthetically pleasing appearance.

4. Mature processing technology, suitable for various graphic processing.

5. The minimum focused spot can reach 7μm, making it suitable for fine cutting and drilling of both organic and inorganic materials.

6. Integrates CNC technology, laser technology, software technology, and other optoelectronic technologies, characterized by high precision and high flexibility.

 

Product Fields:

Applied in the PCB and SMT industries. For cutting and drilling of FPC soft boards, PCB circuit board separation cutting, camera module cutting, fingerprint recognition chip cutting, semiconductor cutting, etc.

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